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Home > Products and Services >> Electronic Device >> B2it >> All B2it PWB
  All B2it PWB
 
Build-up PWB with Random Via on All Layers
Outline
All B2it is a Build-up PWB with random via on all layers.
It facilitates high density mounting and realizes smaller and thinner board.
8 Layer All B2it
8 Layer All B2it
 
Any Layer Random Via
Via on Via, Pad on Via structure enhances Design flexibility.
Ultra Thin Board
B2it offers 3 line-ups (standard, Hyper and Super) according to its bump diameter and board thickness.
Light Weight･High Density Mounting
Bump interconnection structure facilitates high density wiring and let mounted products smaller and lighter.
Earth Consciousness
B2it offers high flexibility of components including Halogen free Br free materials.
   
4 Layer All B2it structure 8 Layer All B2it structure
4 Layer All B2it structure 8 Layer All B2it structure
 
 
Digital Video Camera Mobile Phone Memory Card(e.g.SD card) Module Board
Digital Video Camera Mobile Phone Memory Card(e.g.SD card) Module Board
 
 
 
 

Standard B2it
  Basic Specification
 
8Layer Total Thickness 0.70mm 8Layer Total Thickness 0.70mm 8Layer Total Thickness 0.70mm

*The same design rule is applied to 8 layer PWB and 4 layer PWB.
  Thickness of each part of 8 layer PWB
 
   
  Wiring Rule
Item Specification/Rule
Structure 8 Layer All B2it
Land Dia Φ300μm
Via Dia Φ180μm
CPS Port Pitch 500μm
L/S 75/75μm
Insulation Thickness 75μm(P.P.)
Bump Material Ag Paste
  *Design Rule is subject to variation depending on technology development. Please ask us the latest design rule.
   
   
 
   

Standard B2it
Basic Specification
8Layer Total Thickness 0.70mm 8Layer Total Thickness 0.70mm 8Layer Total Thickness 0.70mm

*The same design rule is applied to 4 layer and 8 layer PWB.
Each Parts' Thickness of 8layer substrate.
 
Wiring Rule
Item Specification/Rule
Name   Hyper B2it Phase1   Hyper B2it Phase2
Structure 8 Layer All B2it
Land Dia Φ300μm   Φ250μm
Via Dia Φ130μm
CPS Port Pitch 400μm
L/S 75/75μm   50/50μm
Insulance Thickness 50μm(P.P.)
Bump Material Ag Paste
*Design Rule is subject to variation depending on technology development. Please ask us the latest design rule
 
 
 

Standard B2it
Basic Specification
8Layer Total Thickness 0.70mm 8Layer Total Thickness 0.70mm 8Layer Total Thickness 0.70mm

*The same design rule is applied to 4 layer and 8 layer PWB.
Each Parts' Thickness of 8 Layer Substrate
 
Wiring Rule
Item Specification/Rule
Name   Super B2it Phase1   Super B2it Phase2
Structure 8 Layer All B2it
Land Dia Φ250μm   Φ180μm
Via Dia Φ80μm
CPS Port Pitch 300μm
L/S 50/50μm   40/40μm
Insulance Thickness 40μm(P.P.)
Bump Material Ag Paste
*Design Rule is subject to variation depending on technology development. Please ask us the latest design rule

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