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Home > Products and Services >> Electronic Device >> B²it >> Combination B²it PWB

Build-up PWB with Random Via on All Layers

Features

1.Adjustment of Thickeness
"Combination B²it PWB" is the combination of B²it interconnection tech and other HDI techs such as through hole and laser, and adjustment of its board thickness is available by adjusting its core layer thickness.

2.3 Step Stacked Via
3 layer build-up structure (3-n-3) realizes 3 step stacked via structure, which also facilitate as high reliability as 1 step stacked via and 2 step stacked via possess. It is also pointed that Combination B²it is an attractive method from the viewpoint of its high productivity and cost performance.

3-n-3 structure	B²it+Laser(1-4-1)structure

3.Replacement with other build-up PWB

Replacement with other build-up PWB is available.

Example of Basic Structure

Following are just some of structure examples.
Please feel free to contact us to obtain details.

example.1	for Mobile Phone	example.2	for Digital Video Camera
	6 layer(2-2-2) 2 layer IVH + 2 layer build-up		8 layer(2-4-2) 4 layer IVH + 2 layer build-up




example.3	for Image Data Processing
	8 layer(3-2-3) 2 layer core + 3 layer build-up

Design Specification

Specification is subject to variation depending on technology development.
Please feel free to contact us to obtain details.

	Item		Specification
	# of build-up steps		1∼3 steps
	# of layers		4∼10 layers(ex:4 layers=1-2-1E10 layers=3-4-3)
	Board Thickness		MIN 0.5mm∼
	Substrate Size		35mm
	Copper Thickness		18μm
	Material		Halogen Free FR-4 (other insulations also available)
	Insulation Thickness		60μm(nominal thickness)
	Surface Engineering		Heatproof/water solubility flux and various gold plate
	Line/Space		more than 50/50μm(IVH plating layer is 75/75μm or more)
	Via Dia		more than Φ150μm
	Land Dia		more than Φ275μm
	Via Pitch		400μm
	Pad on Via		Available
	Stack/Random Via		1-3 Steps available