1.Adjustment of Thickeness
"Combination B2it PWB" is the combination of B2it interconnection technology and other HDI (High Density Interconnect) technologies such as through hole and laser, and adjustment of its board thickness is available by adjusting its core layer thickness.
2.3 Step Stacked Via
3 layer build-up structure (3-n-3) realizes 3 step stacked via structure, which also facilitate as high reliability as 1 step stacked via and 2 step stacked via possess. It is also pointed that Combination B2it is an attractive method from the viewpoint of its high productivity and cost performance.
3-n-3 structure
B2it+Laser(1-4-1)structure
3.Replacement with other build-up PWB
Replacement with other build-up PWB is available.
Example of Basic Structure
Following are just some of structure examples.
Please feel free to contact us to obtain details.
example.1
for Mobile Phone
example.2
for Digital Video Camera
6 layer(2-2-2) 2 layer IVH + 2 layer build-up
8 layer(2-4-2) 4 layer IVH + 2 layer build-up
example.3
for Image Data Processing
8 layer(3-2-3) 2 layer core + 3 layer build-up
Design Specification
Specification is subject to variation depending on technology development.
Please feel free to contact us to obtain details.
Item
Specification
# of build-up steps
1∼3 steps
# of layers
4∼10 layers(ex:4 layers=1-2-1E10 layers=3-4-3)
Board Thickness
MIN 0.5mm∼
Substrate Size
35mm
Copper Thickness
18μm
Material
Halogen Free FR-4 (other insulations also available)
Insulation Thickness
60μm(nominal thickness)
Surface Engineering
Heatproof/water solubility flux and various gold plate
Line/Space
more than 50/50μm(IVH plating layer is 75/75μm or more)
Via Dia
more than Φ150μm
Land Dia
more than Φ275μm
Via Pitch
400μm
Pad on Via
Available
Stack/Random Via
1-3 Steps available
B2it with Copper Filled Via
Combination of B2it and Copper Filled Via Available
■ Specific designs for specific layers.
■ Finer via pitch using B2it's higher productivity.
■ To reduce thermal stress as compared to all copper filled via layers