About DNP America, LLC
Electronic Device Operations
Photomask

DNP Photomask Solution
Brochure.pdf
MEMS
B2it
Design rule
All B2it PWB
Combination B2it PWB
Embedded B2it PWB
Earth Conscious PWB
B2it PWB for camera module
Test Chart & Color Viewer
IC Tag
Video Imaging Products
Dai Nippon Printing Co.,Ltd.
Electronic Device Products
web page
 
 
 
Home > Products and Services >> Electronic Device >> B2it >> Design Rule
B2it -Design Rule-
  Design Rule of Standard/Hyper/Super B2it
   
  【fig.1】Design Rule
  【fig.1】Design Rule
   
  【table.1、EDesign Rule
 
Item Code Class
II Standard III Hyper IV Super
Line/Space a 75/75μm 75/75μm 50/50μm
Land Dia(innerEouter layer) c more than 300μm more than 250μm more than 200μm
Bump Pitch (different potential) d more than 400μm more than 350μm more than 300μm
Bump Pitch (same potential) e more than 300μm more than 300μm more than 250μm
Bump Pitch
(different layer same potential)
f Stacked Available Stacked Available Stacked Available
Bump Land-Bump Land Pitch g more than 75μm more than 75μm more than 50μm
Bump Land-Pattern Pitch h more than 75μm more than 75μm more than 50μm
Pattern between CSP Pad/Space i more than 50/75μm more than 50/50μm more than 50/50μm
  Design Rule
   

 

Copyright © 2010 DNP America, LLC. All rights reserved.
Terms of Use | Privacy Policy