| Item |
Code |
Class |
| II Standard |
III Hyper |
IV Super |
| Line/Space |
a |
75/75μm |
75/75μm |
50/50μm |
| Land Dia(innerEouter layer) |
c |
more than 300μm |
more than 250μm |
more than 200μm |
| Bump Pitch (different potential) |
d |
more than 400μm |
more than 350μm |
more than 300μm |
| Bump Pitch (same potential) |
e |
more than 300μm |
more than 300μm |
more than 250μm |
Bump Pitch
(different layer same potential) |
f |
Stacked Available |
Stacked Available |
Stacked Available |
| Bump Land-Bump Land Pitch |
g |
more than 75μm |
more than 75μm |
more than 50μm |
| Bump Land-Pattern Pitch |
h |
more than 75μm |
more than 75μm |
more than 50μm |
| Pattern between CSP Pad/Space |
i |
more than 50/75μm |
more than 50/50μm |
more than 50/50μm |