In recent years, electronics industry has undergone continuous improvement in developing small･thin･light･fast･multi-function technologies. For its rapid growing number of components, it is estimated that high-density wiring and high-density mounting technologies are indispensable in developing mobile equipments.
Since April 2006, DNP has started the commercial production of passive component embedded PWB in order to meet such needs in developing small electronics products.

We offer mainly two type embedded PWB ;(1)Active Component (IC chip) Embedded PWB(2)Passive Component Embedded PWB.

In November 2008, DNP’s cumulative shipments of passive component embedded PWB reached 100 million pieces from its production commencement in April 2006. DNP has been a leader in embedded PWB market.

DNP has the capacity of a couple million modules per month and will continue to increase to meet demand.

From December 2007, DNP began the embedded PWB production of active and passive components in combination. Since 2009, DNP also produced a number of ICs and passive devices in combination.

• No adjustment of accuracy and the characteristic of chips for their stable properties


• Shortest circuit design available with Random Via and Stacked Via


• High joint strength and high connection reliability


• Realization of ultra slimness

• Surface and inside of PWB are available for mounting. (3D Stack)


• Improve board design flexibility


• Improve reliability by reducing outer I/O connection


• Reduce the numbers of components by optimizing traces


• Shielding effect by board itself


• Embed active and passive devices at once