In recent years, electronics industry has undergone continuous improvement in developing small･thin･light･fast･multi-function techs. For its rapid growing number of components, it is estimated that high-density wiring and high-density mounting techs are indispensable in developing mobile equipments.
DNP started to mass manufacture embedded build-up PWB in order to meet such needs in developing small electronics products.

We offer mainly two type embedded PWB ;(1)Active Component (IC chip) Embedded PWB(2)Passive Component Embedded PWB.

• No adjustment of accuracy and the characteristic of chips for their stable properties
• Shortest circuit design available with Random Via and Stacked Via
• High joint strength and high connection reliability
• Realization of ultra slimness

• Both Surface and Inside of Board Available as Mounting Area (3 dimensional Stack)
• Dramatically Improved the Freedom of Design via 3 Dimensional Mounting
• Improvement of Reliability with Reduced # of External I/O
• Reduced # of Components with Best Wiring
• Shield Effect Expected via Board
• Both passive and active devices can be embedded at the same time.