DNP provides TSV (Through Silicon Via) processing service to the customers as MEMS foundry manufacturer. Specifications of the DNP standard design TSV silicon interposer include via diameter of 50μm, depth (wafer thickness) of 400μm, and through hole pitch of 200μm for both 6 and 8 inch wafer size. It is also possible to customize some kind of specification based on customer request.

DNP has developed a DNP standard TSV TEG that facilitates evaluation of TSV. This DNP standard TSV TEG enables verification of basic characteristics of TSV at low price and with short delivery time. DNP standard TSV TEG has a via diameter of 50μm filled with Cu, a depth (wafer thickness) of 400μm, through hole pitch of 200μm and 1~2 RDL for both side. Customer can evaluate electrical resistance and high-frequency characteristics using the TSV TEG.

6 inch wafer size
(DNP standard TSV TEG)